30 nm device channel profile optimization for digital application by using numerical simulation

Gongchuan Li, Wenli Wang, L. Qi, K. Joardar
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Abstract

Bulk and novel MOSFET structures with gatelengths in 30 nm regime are expected to become industry standards in approximately 2007. In this article we discuss the application of TCAD to the study of analytical (idealized) MOSFET structures in this regime. The electrical properties of 30 nm planar NMOSFET with super halo structure were described with the help of semi-classical transport simulation. in ISE-DESSIS. The device was optimized through an advanced process and device synthesis system, the 3.13e -4 A//spl mu/m saturation current and 8.0e -11 A//spl mu/m leakage current at supply voltage Vd = 0.6 V were obtained for low power and high performance application.
基于数值模拟的30纳米器件通道结构优化
栅极长度在30nm的体积和新型MOSFET结构预计将在2007年左右成为工业标准。在这篇文章中,我们讨论了TCAD在分析(理想)MOSFET结构研究中的应用。利用半经典输运模拟,描述了30 nm平面超晕结构NMOSFET的电学特性。在ISE-DESSIS。通过先进的工艺和器件合成系统对器件进行了优化,在电源电压Vd = 0.6 V时,获得了3.13e -4 A//spl μ /m的饱和电流和8.0e -11 A//spl μ /m的漏电流,实现了低功耗高性能应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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