Ultra high voltage IGBTs in 4H-SiC

S. Ryu, C. Capell, C. Jonas, Y. Lemma, M. O'loughlin, J. Clayton, E. van Brunt, K. Lam, J. Richmond, A. Burk, D. Grider, S. Allen, J. Palmour, A. Agarwal, A. Kadavelugu, S. Bhattacharya
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引用次数: 36

Abstract

A 1 cm × 1 cm 4H-SiC N-IGBT exhibited a blocking voltage of 20.7 kV with a leakage current of 140 μA, which represents the highest blocking voltage reported from an MOS semiconductor power switching device to date. The device showed a VF of 6.4 V at an IC of 20 A, and a differential Ron,sp of 28 mΩ-cm2. Temperature insensitive on-state characteristics were demonstrated. Switching measurements with a supply voltage of 8 kV were performed, and a turn-off time of 720 ns and a turn-off loss of 5.4 mJ were measured at 25°C, for a 8.4 mm × 8.4 mm device with 140 μm drift layer and 5 μm Field Stop buffer layer. It was demonstrated that the charge injection from the backside can be controlled by varying the thickness of the Field-Stop buffer layer. A 55 kW, 1.7 kV to 7 kV boost converter operating at 5 kHz was demonstrated using the 4H-SiC N-IGBT, and an efficiency value of 97.8% was reported.
4H-SiC超高压igbt
1 cm × 1 cm 4H-SiC N-IGBT的阻断电压为20.7 kV,漏电流为140 μA,是迄今为止报道的MOS半导体功率开关器件的最高阻断电压。该器件显示,在20 a的IC下,VF为6.4 V,差分Ron为28 mΩ-cm2。证明了温度不敏感的导态特性。采用140 μm漂移层和5 μm场停止缓冲层的8.4 mm × 8.4 mm器件,在电源电压为8 kV时进行了开关测量,在25°C下测量了720 ns的关断时间和5.4 mJ的关断损耗。结果表明,通过改变场阻缓冲层的厚度,可以控制从背面注入的电荷。采用4H-SiC N-IGBT,实现了工作频率为5khz、55kw、1.7 kV至7kv的升压变换器,效率值为97.8%。
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