Analysis of 3D conjugate heat transfers in electronics

Abstract

An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software: a conductive software based on the Boundary Element Method (REBECA-3D(R)) and a convective software based on the Volume Finite Method (FLUENT). The methodology is tested on a Multi Chip Module (CPGA224) for which experiments have been performed by the CNRS (French National Center for Scientific Research).