Sintering process of mixed solvent system frit to improve the performance of the film in glass/glass laser bonding

Abstract

Organic carrier is the main factor affecting the morphology of the glass frit sintering, and the shape of the sintering determines the quality of the laser encapsulation. In this work, the volatility of single solvent and mixed solvent have been analyzed, and the sintered temperature curve has been optimized. After the sintering, scanning electron microscopy (SEM) images of the single solvent and mixed solvent glass frit films have been achieved. The results show that the mixed solvent glass frit film has the less and smaller bubble defects after sintering process and the size of defects has been deceased by 5.04 µm. The temperature curve of sintering can be set according to the result of thermal gravimetric analysis. This approach can improve efficiency and quality of the glass frit laser bonding process. The best performance of the mixed solvent composed of three kinds of organic solvents and other additives has huge potential as a carrier of glass frit for laser encapsulation.