{"title":"Impact of on-chip inductance when transitioning from Al to Cu based technology","authors":"Tom Chen","doi":"10.1109/ISQED.2001.915223","DOIUrl":null,"url":null,"abstract":"How does on-chip inductance impact timing closure when transitioning from Al to Cu based technology? This paper presents some experimental results based on a Al-based 0.18 /spl mu/m CMOS process and a Cu-based 0.13 /spl mu/m CMOS process. The results show that the impact of on-chip inductance is slightly more on the Cu-based 0.13 /spl mu/m process than on the Al-based 0.18 /spl mu/m process. Furthermore, the results demonstrate that on-chip inductance plays an insignificant role if we assume a perfect power supply network around the interconnect routes.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2001.915223","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
How does on-chip inductance impact timing closure when transitioning from Al to Cu based technology? This paper presents some experimental results based on a Al-based 0.18 /spl mu/m CMOS process and a Cu-based 0.13 /spl mu/m CMOS process. The results show that the impact of on-chip inductance is slightly more on the Cu-based 0.13 /spl mu/m process than on the Al-based 0.18 /spl mu/m process. Furthermore, the results demonstrate that on-chip inductance plays an insignificant role if we assume a perfect power supply network around the interconnect routes.