Advanced package circuit modification by μMilling

C. Hollerith, B. Kruger, Gurcan Gezerci, S. Pauthner, G. Zimmermann
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Abstract

As packages get smaller and more complex the necessity grows to do electrical modifications in packages to assist design process. Milling machines with accuracy of sub-μm enable a fast and effective approach to do such a kind of modification. In combination with other techniques, cutting of package connections as well as reconnecting of metal lines is possible.
先进的封装电路修改μ铣
随着封装变得越来越小,越来越复杂,需要在封装中进行电气修改以辅助设计过程。亚μm精度的铣床可以快速有效地进行此类修改。与其他技术相结合,可以切割封装连接以及重新连接金属线。
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