V. Senthilraja, Rehet Chugh, Sehej Chugh, E. Yang, Himanshu Wagh
{"title":"Comparing Effectiveness of Different Microhomology Lengths in Microhomology Mediated End Joining (MMEJ) Repair of DNA Double Stranded Breaks (DSBs)","authors":"V. Senthilraja, Rehet Chugh, Sehej Chugh, E. Yang, Himanshu Wagh","doi":"10.53043/2320-1991.acbs1005","DOIUrl":null,"url":null,"abstract":"DNA Double-Stranded Breaks (DSBs) are caused by genotoxic agents, such as ionizing radiation and chemical agents, and can cause an affected cell to undergo apoptosis or cell death. The process of microhomology-mediated end joining (MMEJ) shows promising results in the repair of DSBs in DNA. MMEJ is a mutagenic DSB repair mechanism that uses a certain length of homologous nucleotides adjacent to the DSB to align the broken DNA strands for repair. This can result in insertions, deletions, and even translocations of genes at the DSB site. This has led to discussions of debate on whether MMEJ is efficient in repairing DSBs in DNA. Based on the length of microhomology, the effectiveness of the DSB repair can vary. The purpose of this research is to examine MMEJ repair using micro-homologies of different lengths in Saccharomyces cerevisiae cells to test the effectiveness of MMEJ repair. The HIS3 gene located in chromosome 15 in the yeast cell is used to test for MMEJ repair, and the full microhomology length represents 311 base pairs (bp). Various crosses are performed on cells to attain desired genotypes that have the homologous chromosomes in alignment for MMEJ repair. After inducing DSBs, media-based testing is used for testing the efficiency of MMEj repair by checking for the presence of certain genes that may have formed or been deleted during the repair process.","PeriodicalId":191002,"journal":{"name":"Applied Cell Biology","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Cell Biology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.53043/2320-1991.acbs1005","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
DNA Double-Stranded Breaks (DSBs) are caused by genotoxic agents, such as ionizing radiation and chemical agents, and can cause an affected cell to undergo apoptosis or cell death. The process of microhomology-mediated end joining (MMEJ) shows promising results in the repair of DSBs in DNA. MMEJ is a mutagenic DSB repair mechanism that uses a certain length of homologous nucleotides adjacent to the DSB to align the broken DNA strands for repair. This can result in insertions, deletions, and even translocations of genes at the DSB site. This has led to discussions of debate on whether MMEJ is efficient in repairing DSBs in DNA. Based on the length of microhomology, the effectiveness of the DSB repair can vary. The purpose of this research is to examine MMEJ repair using micro-homologies of different lengths in Saccharomyces cerevisiae cells to test the effectiveness of MMEJ repair. The HIS3 gene located in chromosome 15 in the yeast cell is used to test for MMEJ repair, and the full microhomology length represents 311 base pairs (bp). Various crosses are performed on cells to attain desired genotypes that have the homologous chromosomes in alignment for MMEJ repair. After inducing DSBs, media-based testing is used for testing the efficiency of MMEj repair by checking for the presence of certain genes that may have formed or been deleted during the repair process.
DNA双链断裂(DSBs)是由基因毒性物质引起的,如电离辐射和化学物质,并可导致受影响的细胞发生凋亡或细胞死亡。微同源介导的末端连接(microhomology-mediated end joining, MMEJ)在DNA中dsb的修复中显示出良好的效果。MMEJ是一种诱变的DSB修复机制,它利用DSB附近一定长度的同源核苷酸将断裂的DNA链对齐进行修复。这可能导致在DSB位点的基因插入、缺失甚至易位。这引发了关于MMEJ是否有效修复DNA中的dsb的争论。基于微同源性的长度,DSB修复的有效性会有所不同。本研究的目的是利用酿酒酵母细胞中不同长度的微同源性来检测MMEJ的修复,以检验MMEJ修复的有效性。酵母细胞中位于第15染色体的HIS3基因用于检测MMEJ修复,其全微同源长度为311碱基对(bp)。在细胞上进行各种杂交以获得所需的基因型,这些基因型具有用于MMEJ修复的同源染色体。在诱导dsb后,通过检测在修复过程中可能形成或被删除的某些基因的存在,采用基于介质的检测来检测MMEj修复的效率。