T. Youssef, E. Woirgard, S. Azzopardi, D. Martineau, R. Meuret
{"title":"Multi-physics modelling of thin films: Optimization for finite elements simulations tools","authors":"T. Youssef, E. Woirgard, S. Azzopardi, D. Martineau, R. Meuret","doi":"10.1109/EUROSIME.2015.7103138","DOIUrl":null,"url":null,"abstract":"This paper focuses on the thin Nickel layer thicknesses. Thermal and mechanical behaviors of these thin layers in a power module are investigated. An approach is shown in order to present an improved modeling by considering the effect of these thin layers and by reducing time computation.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2015.7103138","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper focuses on the thin Nickel layer thicknesses. Thermal and mechanical behaviors of these thin layers in a power module are investigated. An approach is shown in order to present an improved modeling by considering the effect of these thin layers and by reducing time computation.