Review of applications of Defect Photoluminescence Imaging (DPLI) during IC processing

L. Jastrzebski, R. Duru, D. Le-Cunff, M. Cannac, S. Joblot, I. Mica, M. Polignano, A. Galbiati, P. Monge, Roffarello, G. Nadudvari, Z. Kiss, I. Lajtos, A. Pongrácz, G. Molnár, M. Nagy, L. Dudás, P. Basa, B. Greenwood, J. Gambino
{"title":"Review of applications of Defect Photoluminescence Imaging (DPLI) during IC processing","authors":"L. Jastrzebski, R. Duru, D. Le-Cunff, M. Cannac, S. Joblot, I. Mica, M. Polignano, A. Galbiati, P. Monge, Roffarello, G. Nadudvari, Z. Kiss, I. Lajtos, A. Pongrácz, G. Molnár, M. Nagy, L. Dudás, P. Basa, B. Greenwood, J. Gambino","doi":"10.23919/IWJT.2019.8802893","DOIUrl":null,"url":null,"abstract":"As Si is an indirect band gap material, the PL generated by phonon assisted band-to-band (B2B) radiative recombination (of energy equal to energy gap of Si) is very weak; about 10 orders of magnitude lower than the exciting photon flux [1] . If crystallographic defects are present then at room temperature an additional broad defect PL peak is generated (DPL) with energy smaller than the band gap of Si [1] , [2] , [3] . At room temperature, defect-band PL intensity is orders of magnitude lower than the B2B intensity [1] .","PeriodicalId":441279,"journal":{"name":"2019 19th International Workshop on Junction Technology (IWJT)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 19th International Workshop on Junction Technology (IWJT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/IWJT.2019.8802893","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

As Si is an indirect band gap material, the PL generated by phonon assisted band-to-band (B2B) radiative recombination (of energy equal to energy gap of Si) is very weak; about 10 orders of magnitude lower than the exciting photon flux [1] . If crystallographic defects are present then at room temperature an additional broad defect PL peak is generated (DPL) with energy smaller than the band gap of Si [1] , [2] , [3] . At room temperature, defect-band PL intensity is orders of magnitude lower than the B2B intensity [1] .
缺陷光致发光成像(DPLI)在集成电路加工中的应用综述
由于Si是一种间接带隙材料,声子辅助带对带(B2B)辐射复合(能量等于Si的能隙)产生的PL非常弱;大约比激发光子通量低10个数量级[1]。如果存在晶体缺陷,则在室温下产生一个额外的宽缺陷PL峰(DPL),其能量小于Si的带隙[1],[2],[3]。在室温下,缺陷带的PL强度比B2B强度低几个数量级[1]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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