Impact of Graded Back-Barrier on Linearity of Recessed Gate InAlN/GaN HEMT

Megha Sharma, R. Chaujar
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引用次数: 7

Abstract

Work presented in this paper reports the impact of graded AlGaN back-barrier on the linearity performance of lattice-matched InAlN/AlN/GaN recess gate device. Specifically, a comparison is made on the linearity of the proposed device with and without a graded back barrier layer. Various device performance matrices namely transconductance (gm) and its higher-order derivatives, second and third-order voltage intercept point (VIP2, VIP3), 3rd order input intercept point (IIP3), 3rd inter-modulation distortion (IMD3) and 1-dB compression point have been investigated and discussed for the proposed device architecture. Results obtained from TCAD simulation of the proposed device confirms that by using graded back-barrier the linearity performance matrices of the device are improved, which further shows that the proposed device is also suitable for wireless applications.
梯度背势垒对嵌入式栅InAlN/GaN HEMT线性度的影响
本文报道了梯度AlGaN背势垒对晶格匹配InAlN/AlN/GaN凹槽栅器件线性性能的影响。具体来说,比较了所提出的器件的线性度,有和没有梯度背势垒层。各种器件性能矩阵,即跨导(gm)及其高阶导数,二阶和三阶电压截点(VIP2, VIP3),三阶输入截点(IIP3),三阶调制间失真(IMD3)和1 db压缩点,已经研究和讨论了所提出的器件架构。TCAD仿真结果表明,采用梯度背障后器件的线性性能矩阵得到了改善,进一步表明该器件也适用于无线应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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