A micromachined polyimide aperture for stable bilayer lipid membrane (BLM)s

M. Eray, N. Dogan, Lianjun Liu, A. Koch, D. Moffett, M. Silber, B. V. Van Wie
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引用次数: 4

Abstract

Summary form only given. Silicon micromachining is used to fabricate reproducible miniature apertures over photosensitive polyimide (PPI) layers (septa), with highly controllable dimensions. PPI, having a high level of planarization, chemical inertness, a low dielectric constant, and good mechanical strength, is a very suitable material to be used as BLM septa. Apertures of approximately 5 mu m thickness and approximately 40 mu m diameter in PPI septa suspended over thick silicon rims were realized. The fabrication process includes double-side oxide growth on the wafer, spin-coating the PPI and its patterning, back surface anisotropic window etching, and a final cleaning step. Apertures with high circular symmetry were fabricated using this process. The BLM is formed by dropping a small amount of phospholipid-alkane solution over the PPI aperture. An initially few- mu m-thick membrane spontaneously thins down to an approximately 50 AA thick BLM. Specific capacitance measurements of these BLMs revealed stability of up to 50 h. >
用于稳定双层脂质膜的微加工聚酰亚胺孔径
只提供摘要形式。硅微机械加工用于在光敏聚酰亚胺(PPI)层(septa)上制造可重复的微孔,具有高度可控的尺寸。PPI具有高度的平整度、化学惰性、低介电常数和良好的机械强度,是一种非常适合用作BLM隔膜的材料。在悬浮在厚硅环上的PPI隔膜中实现了大约5 μ m厚度和大约40 μ m直径的孔。制造过程包括晶圆上的双面氧化物生长,旋转涂覆PPI及其图案,背表面各向异性窗口蚀刻和最后的清洗步骤。利用该工艺制备了具有高圆对称性的孔。BLM是通过在PPI孔上滴入少量磷脂-烷烃溶液形成的。最初几μ m厚的膜自发地薄到大约50 AA厚的BLM。这些blm的特定电容测量显示稳定性长达50小时。
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