Current transport mechanisms of Ge/sub 1-y/C/sub y//Si heterojunction diodes

F. Chen, J. Kolodzey
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Abstract

Alloys of group IV semiconductors have attracted more and more attention recently as a material for use in the development of Si-based heterostructure devices. In this paper, the current transport mechanisms of relaxed p-type Ge/sub 1-y/C/sub y/ alloy films on n-type Si at both forward and reverse bias were studied. The current transport is dominated by combined thermal injection, defect tunneling, and recombination mechanisms. The presence of carbon reduces interface states, decreases the leakage current, and increases forward turn-on voltage. This paper demonstrates the benefits of alloying C into Ge and the promising characteristics of Ge/sub 1-y/C/sub y//Si heterostructure devices for future electronic and optoelectronic applications.
Ge/sub - 1-y/C/sub -y/ /Si异质结二极管的电流输运机制
IV族半导体合金作为一种用于硅基异质结构器件开发的材料,近年来受到越来越多的关注。本文研究了弛豫p型Ge/sub - 1-y/C/sub -y/合金薄膜在n型Si上正向和反向偏压下的电流输运机制。电流输运主要由复合热注入、缺陷隧穿和复合机制主导。碳的存在降低了界面状态,减小了漏电流,增加了正向导通电压。本文论证了将C合金化成Ge的好处,以及Ge/sub 1-y/C/sub y//Si异质结构器件在未来电子和光电子应用中的前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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