Packaging characteristics of 6-layer ultra low-k/Cu dual damascene interconnect featuring advanced scalable porous silica (k=2.1)

Abstract

To enhance the process damage tolerance, a 2nd generation scalable porous silica (k=2.1) has been developed by reducing pore-size to 2/3. Using this new low-k film, hybrid dual-damascene interconnects were successfully fabricated with low thermal stress and high adhesion strength. Packaging performance of the six-layered multilevel interconnects was also evaluated with wire-bonding and temperature-cycle tests.