Novel Micro-Textured Film Offers Promise in Universal Handling of 3D Devices

Abstract

This paper will discuss the challenges associated with the constant evolution of IC device dimensions, and the need for carriers that can adapt quickly to the change in form factor but still maintain JEDEC standards for compatibility with existing equipment sets and pick & place tools. The paper will present a new technology inspired by gecko fibril microstructures with reversible adhesion that offers a unique approach to device handling.