Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints

Jie Meng, Katsutoshi Kawakami, A. Coskun
{"title":"Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints","authors":"Jie Meng, Katsutoshi Kawakami, A. Coskun","doi":"10.1145/2228360.2228477","DOIUrl":null,"url":null,"abstract":"3D multicore systems with stacked DRAM have the potential to boost system performance significantly; however, this performance increase may cause 3D systems to exceed the power budget or create thermal hot spots. This paper introduces a framework to model on-chip DRAM accesses and analyzes performance, power, and temperature tradeoffs of 3D systems. We propose a runtime optimization policy to maximize performance while maintaining power and thermal constraints. Our policy dynamically monitors workload behavior and selects among low-power and turbo operating modes accordingly. Experiments with multithreaded workloads demonstrate up to 49% energy efficiency improvements compared to existing thermal management policies.","PeriodicalId":263599,"journal":{"name":"DAC Design Automation Conference 2012","volume":"263 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"135","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"DAC Design Automation Conference 2012","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2228360.2228477","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 135

Abstract

3D multicore systems with stacked DRAM have the potential to boost system performance significantly; however, this performance increase may cause 3D systems to exceed the power budget or create thermal hot spots. This paper introduces a framework to model on-chip DRAM accesses and analyzes performance, power, and temperature tradeoffs of 3D systems. We propose a runtime optimization policy to maximize performance while maintaining power and thermal constraints. Our policy dynamically monitors workload behavior and selects among low-power and turbo operating modes accordingly. Experiments with multithreaded workloads demonstrate up to 49% energy efficiency improvements compared to existing thermal management policies.
基于堆叠DRAM的3d多核系统在功率和热约束下的能效优化
具有堆叠DRAM的3D多核系统具有显著提高系统性能的潜力;然而,这种性能提升可能会导致3D系统超出功率预算或产生热热点。本文介绍了一个对片上DRAM访问建模的框架,并分析了3D系统的性能、功耗和温度权衡。我们提出了一个运行时优化策略,以最大限度地提高性能,同时保持功率和热约束。我们的策略动态监控工作负载行为,并相应地选择低功耗和涡轮工作模式。多线程工作负载的实验表明,与现有的热管理策略相比,能效提高了49%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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