Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012436

V. Eveloy, P. Rodgers, J. Lohan

{"title":"Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component","authors":"V. Eveloy, P. Rodgers, J. Lohan","doi":"10.1109/ITHERM.2002.1012436","DOIUrl":null,"url":null,"abstract":"Numerical predictive accuracy is investigated for transient component heat transfer using a computational fluid dynamics (CFD) code dedicated to the thermal analysis of electronic equipment. The test cases are based on a single printed circuit board (PCB)-mounted, 160-lead PQFP component, analyzed in still-air, and both 1 and 2.25 m/s forced airflows. Three types of transient operating conditions are considered, namely (i) component dynamic power dissipation in fixed ambient conditions, (ii) passive component operation in dynamic ambient conditions, and (iii) combined component dynamic power dissipation in varying ambient conditions. Benchmark criteria are based on component junction temperature and component-PCB surface temperature, measured using thermal test dies and infrared thermography respectively. Using both nominal component/PCB geometry dimensions and material properties, component junction temperature is found to be accurately predicted for component dynamic power dissipation, in both fixed and varying ambient air temperature conditions.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"121 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012436","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 8

Abstract

Numerical predictive accuracy is investigated for transient component heat transfer using a computational fluid dynamics (CFD) code dedicated to the thermal analysis of electronic equipment. The test cases are based on a single printed circuit board (PCB)-mounted, 160-lead PQFP component, analyzed in still-air, and both 1 and 2.25 m/s forced airflows. Three types of transient operating conditions are considered, namely (i) component dynamic power dissipation in fixed ambient conditions, (ii) passive component operation in dynamic ambient conditions, and (iii) combined component dynamic power dissipation in varying ambient conditions. Benchmark criteria are based on component junction temperature and component-PCB surface temperature, measured using thermal test dies and infrared thermography respectively. Using both nominal component/PCB geometry dimensions and material properties, component junction temperature is found to be accurately predicted for component dynamic power dissipation, in both fixed and varying ambient air temperature conditions.

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板载电子元件瞬态热行为的数值预测与实验测量的比较

利用专用于电子设备热分析的计算流体动力学(CFD)程序研究了瞬态元件传热的数值预测精度。测试用例基于安装在单个印刷电路板(PCB)上的160引线PQFP组件，在静止空气中以及1和2.25 m/s的强制气流中进行分析。考虑三种暂态工况，即(i)固定环境条件下的元器件动态功耗，(ii)动态环境条件下的无源元器件运行，以及(iii)变化环境条件下的组合元器件动态功耗。基准标准是基于组件结温度和组件- pcb表面温度，分别使用热测试模具和红外热成像测量。利用标称元件/PCB几何尺寸和材料特性，在固定和变化的环境空气温度条件下，可以准确地预测元件的动态功耗。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

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