Interpolating inductance coupling effects for package and PCB simulation

Abstract

A simple interpolating formula is proposed to model the frequency dependent inductance coupling effect between parallel plate and stripline modes. It requires only DC and high-frequency results of a transmission line. These results can be obtained more efficiently as compared to a general wide band 2D full wave simulation algorithm such as FEM or MOM. Numerical tests show that the proposed method agrees reasonably well with 2D full wave simulation