Development on main chain scission resists for high-NA EUV lithography

A. Shirotori, M. Hoshino, M. Fujimura, Sin Fu Yeh, H. Suh, D. De Simone, G. Vandenberghe, Hideaki Sanuki
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Abstract

In this work, we introduce main chain scission resists with new concept for High-NA’s generation and report their lithography performance. Zeon has developed a new resist (ZER02#06M) in order to improve both resolution and lithography performance because conventional Zeon resists generated worse resolution and kissing(C/H), pinching(L/S) defects at tight pitch by top loss. The concreate approaches in order to improve the challenges are that to make scission reaction efficient and to get developability at exposed area higher in changing both monomers and functional groups. Zeon aims to make clear threshold between exposed and un-exposed area and improve low contrast and sensitivity at tight patterns especially. The lithography performance of ZER02#06M with their approaches were able to improve LCDU and margin with low LCDU on litho-performance compared to ZER02#04DM and ZER02#05M. Additionally, Zeon resists are indicated to have long-terms stability during litho-process with delay.
高na极紫外光刻用主链断裂抗蚀剂的研制
在本工作中,我们介绍了具有新概念的High-NA代主链断裂电阻,并报告了它们的光刻性能。Zeon开发了一种新的抗蚀剂(ZER02#06M),以提高分辨率和光刻性能,因为传统的Zeon抗蚀剂在紧螺距处由于顶部损失而产生较差的分辨率和接吻(C/H),挤压(L/S)缺陷。解决这一难题的具体途径是通过改变单体和官能团来提高裂解反应效率和暴露区域的显影性。Zeon旨在明确曝光和未曝光区域之间的阈值,特别是在密集模式下改善低对比度和灵敏度。与ZER02#04DM和ZER02#05M相比,采用他们的方法的ZER02#06M光刻性能能够提高lcd和低lcd对光刻性能的影响。此外,Zeon抗蚀剂在光刻过程中具有长期的延迟稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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