Technology of double side exposure and bonding for fabrication of accelerometer

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105) Pub Date : 1998-10-21 DOI:10.1109/ICSICT.1998.786524

Taiping Zhang, Ting Li, Ke-Qiang Deng

引用次数: 0

Abstract

The authors use double sided exposure and bonding and deep etching to fabricate accelerometers and gyroscopes. The technology is based on MEMS processing. The sensor testing is presented.

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加速度计双面曝光及粘接技术

作者采用双面曝光键合和深度蚀刻技术制造加速度计和陀螺仪。该技术基于MEMS加工。介绍了传感器的测试方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)

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