Low profile package technology for IrDA compliant transceivers

Abstract

Vishay Semiconductor GmbH is one of the major suppliers for infrared wireless communication devices, i.e. IrDA compliant transceivers. Devices aimed for the telecommunication market ask for increasingly smaller package outlines with high quality and ever lower power consumption. Two basically different technologies are now on the market: packages based on a leadframe technology and substrate technology (molded PCB). Vishay favors the leadframe and the quest for a small outline package lead to the development of a package utilizing a Chip-on-Chip solution (CoC).