Chih-Hung Sun, Jyi-Tsong Lin, Hsuan-Hsu Chen, Y. Eng, C. Kuo, Tze-Feng Chang, Chun-Yu Chen, Po-Hsieh Lin, Hsien-Nan Chiu
{"title":"Numerical study of non-classical unipolar CMOS with different embedded oxide and gate length","authors":"Chih-Hung Sun, Jyi-Tsong Lin, Hsuan-Hsu Chen, Y. Eng, C. Kuo, Tze-Feng Chang, Chun-Yu Chen, Po-Hsieh Lin, Hsien-Nan Chiu","doi":"10.1109/ISNE.2010.5669137","DOIUrl":null,"url":null,"abstract":"In this paper, we propose a novel unipolar CMOS device with embedded oxide. Good inverter and logic gate output waveforms and behaviors are obtained. Utilizing the punch through effect, the Non-Classical Unipolar CMOS is demonstrated to enhance the tPLH so that the average delay time can be improved 23% when compared with the conventional CMOS. Due to all NMOS structures are only exploited and the common electrodes areas are shared, the layout area can be reduced more than 71%, which leads to significantly increase on the packaging density of CMOS circuits.","PeriodicalId":412093,"journal":{"name":"2010 International Symposium on Next Generation Electronics","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 International Symposium on Next Generation Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISNE.2010.5669137","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, we propose a novel unipolar CMOS device with embedded oxide. Good inverter and logic gate output waveforms and behaviors are obtained. Utilizing the punch through effect, the Non-Classical Unipolar CMOS is demonstrated to enhance the tPLH so that the average delay time can be improved 23% when compared with the conventional CMOS. Due to all NMOS structures are only exploited and the common electrodes areas are shared, the layout area can be reduced more than 71%, which leads to significantly increase on the packaging density of CMOS circuits.