{"title":"The Planar Package Planner for System Designers","authors":"W. Heller, G. Sorkin, K. Maling","doi":"10.1145/800263.809215","DOIUrl":null,"url":null,"abstract":"The Planar Package Planner is a design aid aimed at helping to form a package layout plan, given only the information available during project initiation to digital system logic and package designers. A hierarchical approach is adopted, and a clustering program makes possible use of the layout scheme for bottom-up as well as top-down design. The layout plan for an experimental microprocessor is worked out as an example of the method.","PeriodicalId":290739,"journal":{"name":"19th Design Automation Conference","volume":"116 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"78","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/800263.809215","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 78
Abstract
The Planar Package Planner is a design aid aimed at helping to form a package layout plan, given only the information available during project initiation to digital system logic and package designers. A hierarchical approach is adopted, and a clustering program makes possible use of the layout scheme for bottom-up as well as top-down design. The layout plan for an experimental microprocessor is worked out as an example of the method.