Packaging With Multichip Modules

Abstract

Packaging with multichip modules is rapidly becoming a major thrust in electronic system technology. Multichip modules combine several high-performance silicon or GaAs integrated circuits with a customdesigned multilayer substrate structure which takes full advantage of the integrated circuits' performance (e.g., 100-MHz digital clocks, multi-GHz analog frequencies). These complex "hybrid" structures can be fabricated on various substrate materials using several different dielectridmetallization schemes. Because of the high density and high performance of the electronic devices packaged in multichip modules, stringent new demands are being placed on materials, interconnects, and packaging structures. A systematic review of multichip module structures and materials is presented. Module electronic and physical properties are described along with the potential impact of new materials on module performance.