Diminished Short Channel Effects (SCEs) in Junction Less Double Gate (JL DG) MOSFET

Prashant Kumar, Lalit Rai, N. Gupta, Rashmi Gupta
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Abstract

An analysis of Junction less DG MOSFET structure using TCAD is presented in this paper. The effect of variation in silicon thickness has been investigated for the JL DG MOSFET. The transconductance of proposed structure has been evaluated for the variation in dielectric constant and oxide thickness. The key metric parameters are evaluated for the JL DG MOSFET. Furthermore, parameters are compared with JL SG MOSFET. The proposed device structure shows an excellent immunity against SCEs. The silicon substrate has been replaced with germanium substrate in JL DG MOSFET and comparison has been carried out. The germanium transistors show a reduction in DIBL.
无结双栅MOSFET中减小短沟道效应(SCEs)
本文利用TCAD对无结DG MOSFET结构进行了分析。研究了硅厚度变化对JL - DG MOSFET的影响。根据介电常数和氧化物厚度的变化,对所提出的结构的跨导性进行了评价。对JL DG MOSFET的关键度量参数进行了评估。并与JL型SG型MOSFET进行了参数比较。该器件结构对sce具有良好的抗扰性。在JL - DG MOSFET中,用锗衬底代替了硅衬底,并进行了比较。锗晶体管显示出DIBL的降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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