Compliance metric for the S-bend lead design for surface mount components, with application to clip-leads

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346696

R. Kotlowitz, I.M. Nevarez

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引用次数: 2

Abstract

New stiffness metrics have been developed from an upgraded S-lead structural model that extends compliance evaluation capabilities to a wide variety of commercial S-lead designs. By selectively eliminating lead members, the generalized S-lead structural model can be used to represent a broad range of common lead forms for SM (surface mount) components. The S-lead directional spring constants are given in an easy-to-apply, algebraic format suitable for computer and spread-sheet evaluation. Compliance evaluation has been performed for a commercial S-bend clip-lead specifically developed for high-reliability SM interconnection of CCCs (ceramic chip carriers) on organic circuit-boards. Accelerated powered cycling of clip-leaded CCCs on epoxy-glass circuit-boards has shown that leads with diagonal stiffness in the nominal range of 10-40 lb/in provide a comparatively high margin for SM attachment reliability. The diagonal stiffness of S-bend lead designs can be tailored by using the upgraded compliance formulation to optimize the contour and critical dimensions.<>

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用于表面贴装元件的s弯引线设计的合规性度量，并应用于夹式引线

新的刚度指标是从升级的s导联结构模型中开发出来的，该模型将合规评估能力扩展到各种商业s导联设计中。通过选择性地消除引线构件，广义s引线结构模型可用于表示SM(表面贴装)组件的广泛常见引线形式。s导联定向弹簧常数以易于应用的代数格式给出，适用于计算机和电子表格评估。一种专门为有机电路板上CCCs(陶瓷芯片载体)的高可靠性SM互连而开发的商用s弯夹式引线进行了合规性评估。对环氧玻璃电路板上夹线CCCs的加速动力循环表明，对角刚度在10-40 lb/in的标称范围内的引线为SM连接的可靠性提供了相对较高的边际。s弯引线设计的对角刚度可以通过使用升级的柔度公式来优化轮廓和关键尺寸来定制

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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