Influence of PCB Vibration Modal on Peeling Stress of Solder Joints in Board-level Package Under Drop Impact

Abstract

In this paper, a very detailed finite element model of PCB board and BGA package was constructed. A dynamic drop/impact simulation of the board-level package was conducted by LS-DYNA and Input-G approach under the drop Condition H recommended by JEDEC standard JESD22-B111. A PCB deflection equivalent static analysis was conducted also in order to investigate the difference of peeling stress between the dynamic and the static model.