Experimental and Numerical Simulation Study on Uniformity of Temperature and Flow Field in an Advanced Packaging Electroplating Cell

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI:10.1109/ICEPT.2007.4441374

Dongsheng Zhu, Changhong Wang, Xuan Zhou, S. Tu

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Abstract

An experimental facility of advanced packaging electroplating cell is developed to study the uniformity of the temperature and flow field in the high precision electroplating cell. Based on heat transfer and computational fluid dynamics, a 2D numerical model is founded to analyze the temperature field and flow field of the experimental electroplating cell enclosure. Combing with test and simulated results, the effects of the heat source intensity, ventilated mode and heat transfer coefficient on the thermal field of the cell are discussed. Under the condition of natural convection with temperature gradient driving, although heat/cold source intensity and ventilated mode both have effects on the temperature field and flow field of the electroplating enclosure, the heat/cold source is the more marked factor influencing the uniformity of temperature field and flow field. The experimental and simulated results can give a way to enhance the uniformity of the temperature field and flow field and to improve the quantity of the WL-CSP electroplating.

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先进封装电镀槽内温度和流场均匀性的实验与数值模拟研究

为研究高精度电镀槽内温度场和流场的均匀性，研制了先进封装电镀槽实验装置。基于传热学和计算流体力学的理论，建立了实验电镀电池外壳的二维数值模型，分析了实验电镀电池外壳的温度场和流场。结合试验和模拟结果，讨论了热源强度、通风方式和换热系数对电池热场的影响。在自然对流温度梯度驱动条件下，虽然冷热源强度和通风方式都对电镀机箱的温度场和流场有影响，但冷热源对温度场和流场均匀性的影响更为显著。实验和模拟结果为提高温度场和流场的均匀性，提高WL-CSP电镀质量提供了途径。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2007 8th International Conference on Electronic Packaging Technology

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