A 20ns static column 1Mb DRAM in CMOS technology

K. Sato, H. Kawamoto, K. Yanagisawa, T. Matsumoto, S. Shimizu, R. Hori
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引用次数: 24

Abstract

RECENT DEMANDS FOR DRAMs involve not only LSI, but high-speed column functions with reduced power consumption. This performance can best be accomplished by CMOS because of its low power dissipation and high-speed characteristics. This paper will report the development of a 1Mb static column DRAM using a back bias generator in N-well CMOS technology, with a column address access time of 20ns, a RAS access time of less than 80ns, and power dissipation of 230mW at 210ns cycle time. A photomicrograph of the chip is shown in Figure 1. The cell size is 3 . 3 5 ~ x 7.2p (=24.12p2) using a Corrugated Capacitor Cell (CCC)’. Die size is 4.68mm x 10.lmm (=47.3mm2) assembled in a 300-mil wide 18-pin DIP; Figure 2. The pin arrangement is also shown in this illustration. In the array memory, a folded-bit-line structure has been used with horizontal metal bit and vertical polycide word lines. The array consists of 16 identical blocks on a P-type substrate, with each block halved by sense amplifiers to reduce bit line capacitance, without increasing the width of the chip. Forming column select signals with a second aluminum layer is also useful in a multi-divided bit line structure’, because no additional column decoders are necessary. The bit line-to-cell capacitance ratio resulting from this multi-divided bit line structure is about 6, producing a total sensing signal of 600mV, with a boosted word line; Figure 3. A half Vcc bit line equalization precharging method* was used for low power consumption of the bit lines. The column circuits, shown in Figure 4, are designed to operate in a high speed static column mode. Therefore, CMOS circuitry is used for static operation. Moreover, the address transition detection (ATD) technique was adopted t o reduce the power dissipation at long cycle times. The ATD clock activates a column driver clock (h), a column select signal (YS), and a main amplifier, for a period of time. The ATD control of YS is demonstrated in Figure 3. Typical measured RAS and static column access times are shown in Figure 5 ; RAS access time is 74ns and static column access time is 20ns at a static column cycle (t/sc) of 20ns. The typical active power dissipa-_
采用CMOS技术的20ns静态列1Mb DRAM
最近对dram的需求不仅包括大规模集成电路,还包括降低功耗的高速列功能。由于CMOS具有低功耗和高速的特性,因此可以最好地实现这种性能。本文将报道采用n阱CMOS技术的反向偏置发生器开发1Mb静态列DRAM,其列地址访问时间为20ns, RAS访问时间小于80ns,在210ns周期时间下功耗为230mW。芯片的显微照片如图1所示。单元格大小为3。3 5 ~ x 7.2 2p (=24.12p2)使用瓦楞电容器电池(CCC)。模具尺寸为4.68mm × 10。lmm (=47.3mm2)组装在300 mil宽的18针DIP中;图2。引脚排列也显示在这个插图中。在阵列存储器中,采用了一种水平金属位和垂直多面体字线的折叠位线结构。该阵列在p型衬底上由16个相同的块组成,每个块由感测放大器减半,以减少位线电容,而不增加芯片的宽度。用第二层铝层形成列选择信号在多分位线结构中也很有用,因为不需要额外的列解码器。由这种多分位线结构产生的位线与单元电容比约为6,产生的总传感信号为600mV,具有升压字线;图3。采用半Vcc位线均衡预充电方法*,降低位线功耗。列电路如图4所示,设计用于在高速静态列模式下运行。因此,CMOS电路用于静态操作。此外,为了降低长周期时的功耗,采用了地址转换检测(ATD)技术。ATD时钟激活列驱动时钟(h)、列选择信号(YS)和主放大器一段时间。YS的ATD控制如图3所示。典型的测量RAS和静态列访问时间如图5所示;当静柱周期(t/sc)为20ns时,RAS访问时间为74ns,静柱访问时间为20ns。典型有功功率损耗为-_
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