Roll-to-roll paper sensors (ROPAS); Wireless communicating sensors on paper in the logistic chain

Corné Rentrop, Erik Rubingh, R. Lelieveld, Henrik Sandberg
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引用次数: 4

Abstract

The ROPAS project (Roll-to-roll paper sensors) combines high end electronics and wireless sensors with low cost paper substrates and processing techniques that can be applied on a large scale. Paper is the next step in the printed electronics roadmap of utilising cheaper substrate materials as a replacement of silicon and PET and is generally referred to as paper electronics. The creation of highly conductive structures applied at high speed on (temperature unstable) paper is extremely important to enable paper electronics. Hereto, recent advantages in nanotechnology such as (encapsulation) printing, surface modification of fiber based products, sensor and battery development, and electronic design (wireless communication) are integrated for large scale roll to roll and sheet to sheet paper applications. The possibilities of paper electronics are demonstrated in high impact (security) and logistics applications, which are demonstrated in security tags and smart labels for anti-counterfeiting purposes by e.g. integration of near field communication (NFC) in paper and finally track-and-trace post pieces such as envelopes. The paper explains the project and its impact, including implications of using a rough, coarse, porous and composite, paper substrate of limited high temperature stability on the design and fabrication of demonstrators and building blocks. Important topics herein are: fast curing of conductive inks on paper using state of the art printing techniques such as inkjet, screen and flexogravure. In the talk, synthesis of printable (humidity) sensor materials, placing of electrical components on paper surfaces including electronic design of the wireless communication and environmental and recycling constraints of the products are discussed as well.
卷对卷纸传感器(ROPAS);物流链中的纸上无线通信传感器
ROPAS项目(卷对卷纸张传感器)将高端电子和无线传感器与低成本纸张基材和可大规模应用的加工技术相结合。纸是印刷电子路线图的下一步,利用更便宜的衬底材料作为硅和PET的替代品,通常被称为纸电子。在(温度不稳定的)纸上高速应用高导电结构的创造对于实现纸电子是极其重要的。在这里,纳米技术的最新优势,如(封装)印刷,纤维基产品的表面改性,传感器和电池的开发,以及电子设计(无线通信)被集成为大规模的卷对卷和片对片纸应用。纸质电子产品的可能性在高影响(安全)和物流应用中得到了证明,这在防伪目的的安全标签和智能标签中得到了证明,例如将近场通信(NFC)集成在纸上,并最终跟踪和追踪邮寄件,如信封。本文解释了该项目及其影响,包括使用粗糙,粗糙,多孔和复合,有限高温稳定性的纸基板在设计和制造演示和构建块的影响。本文的重要主题是:使用喷墨、丝网和柔性凹版等先进印刷技术在纸上快速固化导电油墨。在演讲中,可打印(湿度)传感器材料的合成,电子元件在纸表面的放置,包括无线通信的电子设计以及产品的环境和回收限制也进行了讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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