Impact of inductance on timing characteristics of VLSI interconnects

G. Servel, F. Huret, E. Paleczny, P. Kennis, D. Deschacht
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引用次数: 1

Abstract

As the result of the scaling down of technology and increased chip sizes, the cross-sectional area of wires has been reduced. With these trends, it is becoming crucial to be able to determine which nets within a high speed VLSI circuit exhibit prominent inductive effects. The object of this paper is to answer a question frequently put to designers: is inductance necessary to model interconnections or can a simple RC model be sufficient? By comparing the simulation results obtained from electrical simulations to an electromagnetic approach we can verify if the RC distributed model is always sufficient to characterize the propagation delay and the degradation due to the interconnect lines in submicronic circuit. Limits between RC and RLC models are determined.
电感对VLSI互连时序特性的影响
由于技术的缩小和芯片尺寸的增加,导线的横截面积减少了。随着这些趋势,能够确定高速VLSI电路中哪些网络表现出突出的感应效应变得至关重要。本文的目的是回答一个经常被设计人员提出的问题:是否需要电感来建立互连模型,或者一个简单的RC模型就足够了?通过对比电仿真和电磁仿真得到的仿真结果,可以验证RC分布模型是否总是足以表征亚微米电路中由于互连线引起的传播延迟和退化。确定了RC和RLC模型之间的界限。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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