Low temperature microwave annealing of S/D

B. Lojek
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引用次数: 10

Abstract

Microwave annealing of ion-implanted layers in semiconductors is an emerging application of thermal processing of semiconductors, with low processing temperature eliminating unwanted diffusion as the main potential advantage. In this work, requirements and limitations of the microwave processing chamber are discussed first, and secondly, for the first time, results from a processed manufacturing lot using microwave annealing are discussed. The achieved results show that is feasible to achieve the same level of activation of implanted layers as in conventional high temperature RTP processing using the microwave at temperatures below 400 °C, and equivalent processing time.
S/D的低温微波退火
半导体离子注入层微波退火是半导体热加工的一项新兴应用,其主要潜在优势是加工温度低,消除了不必要的扩散。在这项工作中,首先讨论了微波处理室的要求和局限性,其次,首次讨论了使用微波退火处理的制造批次的结果。实验结果表明,在温度低于400℃、处理时间相当的条件下,利用微波实现与传统高温RTP处理相同水平的植入层活化是可行的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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