Bandgap features and thermoelectric properties of Ti-based half-Heusler alloys

S. J. Poon, T. Tritt, Y. Xi, S. Bhattacharya, V. Ponnambalam, A. Pope, R. Littleton, V. M. Browning
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引用次数: 5

Abstract

Electronic transport properties of narrow-gap TiNiSn and presumed wider-gap TiCoSb half-Heusler alloys are investigated by systematically doping the three sublattice sites. The two alloys are found to exhibit different doping trends. While all three sites in TiCoSb can be doped to enhance semimetallic behavior, only the Ti and Ni sites in TiNiSn can be efficiently doped. Meanwhile, several 3d dopants are found to lead to more localized electronic properties. These findings, together with results on Hall effect and thermopower measurements, have shed light on the bandgap structure of these metal-based semiconductors. Power factor and dimensionless figure of merit ZT reaching /spl sim/5.7/spl times/10/sup -3/ W/m-K/sup 2/ and /spl sim/0.5 at 680 K, respectively, are obtained in the Sb-doped (TiHf)NiSn system. The quite favorable thermoelectric parameters obtained in these low-mobility alloys are attributed to the existence of a moderately heavy electron band mass.
ti基半heusler合金的带隙特征及热电性能
通过系统地掺杂三个亚晶格位,研究了窄间隙TiNiSn和假定的宽间隙TiCoSb半heusler合金的电子输运性质。发现两种合金表现出不同的掺杂趋势。虽然TiCoSb中的三个位点都可以掺杂以增强半金属行为,但TiNiSn中的Ti和Ni位点可以有效掺杂。同时,还发现了几种三维掺杂剂,可以获得更局域化的电子性质。这些发现,连同霍尔效应和热功率测量的结果,揭示了这些金属基半导体的带隙结构。在680 K时,掺sb (TiHf)NiSn体系的功率因数和无因次优值ZT分别达到/spl sim/5.7/spl倍/10/sup -3/ W/m-K/sup 2/和/spl sim/0.5。在这些低迁移率合金中获得的相当有利的热电参数归因于存在中等重的电子带质量。
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