High-frequency short-pulsed metal plasma-immersion ion implantation using filtered DC vacuum-arc plasma (part two)

A. Ryabchikov, I. Stepanov, D. Sivin, S. V. Dektyarev, K. Y. Dodorin
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Abstract

An innovative concept in the development of advanced coating deposition and ion implantation method including an application of filtered DC metal plasma source and high-frequency short-pulsed negative bias voltage with a duty factor in the range 10 ÷ 99% are considered. The regularities of ion implantation and metal plasma deposition for dielectric samples are theoretically and experimentally investigated. Experimentally has been shown that metal plasma based ion implantation as well as high-concentration metal plasma ion implantation with compensation of ion surface sputtering by metal plasma deposition as well as ion-assisted coating deposition can be realized by variation of bias potential ranging from 0 V to 4 kV, pulse repetition rate smoothly adjusted in the range (2 ÷ 4.4)×105 p.p.s. and pulse duration ranging from 0.5 to 2 μs. Special features of the material treatment method depending on plasma concentration, pulse repetition rate and duty factor has been examined.
过滤直流真空电弧等离子体高频短脉冲金属等离子体浸没离子注入(下)
在开发先进的涂层沉积和离子注入方法的创新概念中,包括应用滤波直流金属等离子体源和高频短脉冲负偏压,占空比在10 - 99%范围内。从理论上和实验上研究了介电样品离子注入和金属等离子体沉积的规律。实验表明,在0 ~ 4 kV的偏置电位范围内,脉冲重复频率在(2 ÷ 4.4)×105 p.p.s.范围内平滑调节,脉冲持续时间在0.5 ~ 2 μs范围内,可以实现基于金属等离子体的离子注入和离子表面溅射补偿的高浓度金属等离子体离子注入以及离子辅助涂层沉积。材料处理方法的特点取决于血浆浓度,脉冲重复率和占空因数进行了研究。
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