The Investigation on Drain-Source On-State Resistance of SiC power MOSFETs from Single Event Effects Experiment

Li Pengwei, Zhenquan Liang, Li Xingji, Yang Jianqun, Mei Bo, Lv He, Yu Qingkui, Tang Min, Xu Weixin
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引用次数: 1

Abstract

The forward resistance of the SiC power MOSFETs is an important parameter that affects the conductivity device. In order to evaluate the electrical properties of the sample after single-particle irradiation and the effect of changes on its function. In this paper, SiC power MOSFETs single-particle irradiation test after the test sample as the object, Using voltammetry to study VDS-IDS output characteristics and drain-source conduction characteristics. It gives a different VDS-IDS output characteristic parameters of the test samples and drain source on-state resistance with different drain-source bias voltages the law of change. It is pointed out that the internal unit damage after irradiation by single event irradiation of SiC power MOSFETs devices cause the change of the on resistance, it show that anti-single-event reinforcement design to provide reference by SiC power MOSFET devices.
单事件效应实验对SiC功率mosfet漏源导通电阻的研究
SiC功率mosfet的正向电阻是影响器件导电性的重要参数。为了评价单粒子辐照后样品的电学性能及其变化对其功能的影响。本文以SiC功率mosfet单粒子辐照测试后的测试样品为对象,采用伏安法研究了VDS-IDS输出特性和漏源导通特性。给出了不同测试样品的VDS-IDS输出特性参数和漏源导通状态电阻随漏源偏置电压不同的变化规律。指出SiC功率MOSFET器件受单事件辐照后的内部单元损伤引起导通电阻的变化,为SiC功率MOSFET器件的抗单事件强化设计提供参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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