M. Duan, J. F. Zhang, Z. Ji, W. Zhang, B. Kaczer, T. Schram, R. Ritzenthaler, A. Thean, G. Groeseneken, A. Asenov
{"title":"Time-dependent variation: A new defect-based prediction methodology","authors":"M. Duan, J. F. Zhang, Z. Ji, W. Zhang, B. Kaczer, T. Schram, R. Ritzenthaler, A. Thean, G. Groeseneken, A. Asenov","doi":"10.1109/VLSIT.2014.6894373","DOIUrl":null,"url":null,"abstract":"For the first time, different impacts of as-grown and generated defects on nm-sized devices are demonstrated. As-grown hole traps are responsible for WDF, which increases with Vg_op and tw. The generated defects are substantial, but do not contribute to WDF and consequently are not detected by RTN. The non-discharging component follows the same model as that for large devices: the `AG' model. Based on this defect framework, a new methodology is proposed for test engineers to predict the long term TDV and yield and its prediction-capability is verified.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"372 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2014.6894373","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12
Abstract
For the first time, different impacts of as-grown and generated defects on nm-sized devices are demonstrated. As-grown hole traps are responsible for WDF, which increases with Vg_op and tw. The generated defects are substantial, but do not contribute to WDF and consequently are not detected by RTN. The non-discharging component follows the same model as that for large devices: the `AG' model. Based on this defect framework, a new methodology is proposed for test engineers to predict the long term TDV and yield and its prediction-capability is verified.