Networks and Nations: The Interplay of Transnational Networks and Domestic Institutions in China's Chip Design Industry

Douglas B. Fuller
{"title":"Networks and Nations: The Interplay of Transnational Networks and Domestic Institutions in China's Chip Design Industry","authors":"Douglas B. Fuller","doi":"10.1504/IJTM.2010.033804","DOIUrl":null,"url":null,"abstract":"Using China's semiconductor design industry as a case, this article examines the claims made by global production network (GPN) and transnational technology community (TTC) scholars that transnational networks are driving technological development in emerging economies. Due to co-ethnic transnational technology networks and the politics of finance, China's firms experience distinct patterns of performance not well explained by either of these transnational network theories. The network explanations do not go far enough in recognising the domestic environment's importance in its interaction with transnational structures in determining the possibilities for development. This article argues that the state's relationship to firms structures the opportunities of financing for the firms thereby impacting their technological development behaviour. One type of firm, the hybrid foreign invested enterprise, combines foreign finance with commitment to China to drive China's technological development. Other firms, particularly those closely tied to the Chinese state, contribute less or even negatively to China's development.","PeriodicalId":300155,"journal":{"name":"International Institutions: Transnational Networks eJournal","volume":"111 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Institutions: Transnational Networks eJournal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1504/IJTM.2010.033804","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12

Abstract

Using China's semiconductor design industry as a case, this article examines the claims made by global production network (GPN) and transnational technology community (TTC) scholars that transnational networks are driving technological development in emerging economies. Due to co-ethnic transnational technology networks and the politics of finance, China's firms experience distinct patterns of performance not well explained by either of these transnational network theories. The network explanations do not go far enough in recognising the domestic environment's importance in its interaction with transnational structures in determining the possibilities for development. This article argues that the state's relationship to firms structures the opportunities of financing for the firms thereby impacting their technological development behaviour. One type of firm, the hybrid foreign invested enterprise, combines foreign finance with commitment to China to drive China's technological development. Other firms, particularly those closely tied to the Chinese state, contribute less or even negatively to China's development.
网络与国家:中国芯片设计产业中跨国网络与国内机构的相互作用
本文以中国半导体设计产业为例,考察了全球生产网络(GPN)和跨国技术社区(TTC)学者关于跨国网络正在推动新兴经济体技术发展的说法。由于共同民族的跨国技术网络和金融政治,中国企业经历了不同的绩效模式,这两种跨国网络理论都无法很好地解释。在认识到国内环境在与跨国结构相互作用中决定发展可能性的重要性方面,网络解释走得还不够远。本文认为,国家与企业的关系构成了企业融资的机会,从而影响了企业的技术发展行为。一种是混合型外商投资企业,它将外资与对中国的承诺结合起来,推动中国的技术发展。其他公司,尤其是那些与中国政府关系密切的公司,对中国发展的贡献较小,甚至是负面的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书