Evaluation of Failure Mechanisms in Low Thermal Resistance Interface Materials for Reliable Electronics Applications

Abstract

Thermal interface materials are critical for heat dissipation and thus reliable operation of many electronic parts. Considering future challenges such as autonomous driving, reliability is a key factor for safety and performance. This work studies various failure mechanisms which can occur in polymeric thermal interface materials. Each failure mechanism is linked to an experimental setup/method that may help to gain indications for material screening purposes. Various product classes are screened and put into perspective and benefits of each one of these product classes are discussed.