Study of inert gas pressure influence on electroforming and resistive switching of TiN-TiO2-SiO2-W memristors

E. S. Gorlachev, V. Mordvintsev, S. Kudryavtsev
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引用次数: 2

Abstract

In this work we have studied functioning of memristors based on TiN-TiO2-SiO2-W open edge sandwich structures on Si substrates in inert gas medium. A custom-made experimental setup that allowed controlled gas atmosphere within the pressure range of 0.0001-750 Torr was used. The electroforming was performed by a procedure of applying a quasistatic electric pulse of 10-20 V. The resistive switching was performed by pulses of 5 V, 30 ms for the “ON” switching and 5-8 V, 100 ns for the “OFF” switching. We carried out investigations for nitrogen and argon inert gases. As a result, first, we have established that the resistive switching in inert gases (both nitrogen and argon) of the memory elements electroformed in vacuum, reliably takes place in the entire inert gas pressure range including the maximum experimental value of 1 atm. Second, we showed that the electroforming takes place at the maximum inert gas pressure of 100 Torr.
惰性气体压力对TiN-TiO2-SiO2-W记忆电阻器电铸及电阻开关的影响研究
在本工作中,我们研究了在惰性气体介质中基于Si衬底的TiN-TiO2-SiO2-W开边夹层结构的忆阻器的功能。采用定制的实验装置,控制气体气氛的压力范围为0.0001-750 Torr。采用10 ~ 20v的准静态电脉冲进行电铸。电阻开关由5 V, 30 ms的“ON”开关和5-8 V, 100 ns的“OFF”开关进行。开展了氮、氩惰性气体调查。因此,首先,我们确定了真空电铸记忆元件在惰性气体(氮气和氩气)中的电阻开关在整个惰性气体压力范围内可靠地发生,包括最大实验值1atm。其次,我们发现电铸过程发生在最大惰性气体压力为100 Torr的条件下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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