Heterogeneous Integration using the Silicon Interconnect Fabric

Abstract

In the 70's, Amdahl proposed and then abandoned the concept of wafer scale integration to build a high-performance mainframe on a single silicon wafer. Recent developments in advanced packaging such as the Silicon Interconnect Fabric being worked on at UCLA, flexible electronics, three-dimensional integration allow us to revisit this concept with a very high probability of success. This talk will examine the technology, challenges, and architectural benefits of such systems for the heterogeneous integration of massively scaled-out high performance systems as well as physically flexible integration platforms for Medical applications.