Compact substrate integrated waveguide (SIW) components on paper substrate

Abstract

This paper presents the design, fabrication and testing of compact substrate integrated waveguide (SIW) components on paper substrate. These components are particularly suitable for the implementation of eco-friendly wireless systems for the future generation of wireless sensor networks (WSN) and of the Internet of Things (IoT). The use of SIW technology allows to implement waveguide-like components on different materials, providing easy fabrication, low loss, and complete shielding. The novel fabrication technology proposed in this paper is based on the use of stacked paper sheets with top and bottom aluminum foils, and the subsequent shape manufacturing by milling. The compactness of the proposed components derives from the use of half-mode and quarter-mode topologies. Straight interconnects and filters are designed and manufactured, to verify the proposed fabrication technique.