High Performance Dual Field Plate Trench MOSFETs for Middle-voltage Applications

Shuhei Tokuyama, Hiroaki Kato, T. Kachi, K. Miyashita, Kenya Kobayashi
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Abstract

We propose a 200 V-class dual-field-plate (DFP) trench MOSFET (DFP MOSFET), which has multiple field-plate of different length inside the deep trench. This structure can be formed by simple DFP process. To clarify optimum design of DFP structure and reveal its potential, we verify the significant device parameters by TCAD simulation. We obtained a specific on-resistance of $147.7\ \ \mathrm{m}\Omega\cdot \text{mm}^{2}$ at a breakdown voltage of 237 V, which is the best result in comparable voltage rating MOSFETs.
用于中压应用的高性能双场极板沟槽mosfet
我们提出了一种200v级双场极板(DFP)沟槽MOSFET (DFP MOSFET),它在深沟槽内具有多个不同长度的场极板。这种结构可以通过简单的DFP过程形成。为了明确DFP结构的优化设计,揭示其潜力,我们通过TCAD仿真验证了重要的器件参数。在237v击穿电压下,我们获得了$147.7\ \ \mathrm{m}\Omega\cdot \text{mm}^{2}$的导通电阻,这是同类额定电压mosfet中最好的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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