3D Printed K-Band Air-Filled Waveguide Directional Coupler Integrated with PCB Using a Through-Patch Transition

I. Piekarz, J. Sorocki, S. Gruszczynski, K. Wincza
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引用次数: 1

Abstract

In this paper, a recently developed highly integrated hybrid fabricated stack-up is explored for the implementation of passive waveguide microwave front-end components such as power dividers/combiners. The stack-up leverages the additive manufacturing for integration of a 3D printed and metal-coated air-filled waveguide with a Printed Circuit Board (PCB) by sharing a common ground plane, which allows for further integration with active circuitry. A through-patch transition is used to interconnect the two guides. The concept was experimentally verified by fabrication and measurements of an exemplary equal power split directional coupler in WR-42 waveguide geometry to operate at f0 = 20 GHz being fed by on-PCB microstrip lines.
3D打印的k波段充气波导定向耦合器与使用通片过渡的PCB集成
本文探讨了一种新开发的高集成度混合制造堆栈,用于实现无源波导微波前端元件,如功率分配器/合成器。堆叠利用增材制造将3D打印和金属涂层充气波导与印刷电路板(PCB)集成在一起,通过共享公共接地平面,从而允许与有源电路进一步集成。一个通片过渡被用来连接两个导轨。该概念通过WR-42波导几何形状的示例性等功率分裂定向耦合器的制造和测量进行了实验验证,该耦合器工作在f0 = 20 GHz,由pcb上微带线馈电。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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