A multi-level memory system architecture for high performance DSP applications

S. Agarwala, Charles Fuoco, T. Anderson, D. Comisky, Christopher Mobley
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引用次数: 10

Abstract

With the explosion of Digital Signal Processor (DSP) applications, there is a constant requirement for increased processing capability. This in turn requires rapid performance scaling in both operations per cycle and cycles per second, both of which result in increased MIPS/MMACS/MFLOPs. The memory system has to sustain the increased frequency and bandwidth demands in order to meet the data requirements of the DSP. Traditionally, DSP system architectures have on-chip addressable RAM, which is accessible by both the central processing unit (CPU) and the direct memory access (DMA). However, RAM frequencies are not scaling along with CPU clock rates, and as a result only relatively small RAM sizes are able to meet the frequency goals. This is in direct contrast to the increasing program size requirements seen by DSP applications, which in turn require even more on-chip RAM. This paper proposes a solution which has caches and RAMs coexisting in a homogeneous environment and working seamlessly together allowing high frequencies while still maintaining the DSP goals of low cost and low power. This multi-level memory system architecture has been implemented on the Texas Instruments (TI) TMS320C6211 C6x DSP.
一种用于高性能DSP应用的多级存储系统架构
随着数字信号处理器(DSP)应用的爆炸式增长,对其处理能力的要求不断提高。这反过来又需要在每周期和每秒周期的操作中快速扩展性能,这两者都会导致MIPS/MMACS/MFLOPs的增加。为了满足DSP的数据需求,存储系统必须承受不断增加的频率和带宽需求。传统上,DSP系统架构具有片上可寻址RAM,可由中央处理单元(CPU)和直接存储器访问(DMA)访问。然而,RAM频率不会随着CPU时钟速率的变化而变化,因此只有相对较小的RAM尺寸才能满足频率目标。这与DSP应用程序所看到的不断增加的程序大小要求形成直接对比,后者反过来需要更多的片上RAM。本文提出了一种解决方案,该方案使高速缓存和ram在同质环境中共存,并无缝地协同工作,允许高频率,同时仍然保持低成本和低功耗的DSP目标。该多级存储系统架构已在德州仪器(TI)的TMS320C6211 C6x DSP上实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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