Processing, properties, and reliability of electroplated lead-free solder bumps

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012552

R. Kiumi, J. Yoshioka, F. Kuriyama, N. Saito, M. Shimoyama

{"title":"Processing, properties, and reliability of electroplated lead-free solder bumps","authors":"R. Kiumi, J. Yoshioka, F. Kuriyama, N. Saito, M. Shimoyama","doi":"10.1109/ITHERM.2002.1012552","DOIUrl":null,"url":null,"abstract":"Eutectic tin-silver (Sn-Ag), tin-copper (Sn-Cu), and tin-silver-copper (Sn-Ag-Cu) solder alloys are potential lead-free materials for low-temperature processing of solder bumps on wafers. But, before they can be adopted to replace the existing lead-free materials, processes have to be developed to provide controls over composition, height and shape uniformity, and defect formation, such as micro-voids, which are detrimental to bump reliability. Over the last six years, we have developed an electroplating technology using a dip-plating machine for processing the three types of eutectic lead-free solder bumps on silicon wafer. Our process is suitable for mass production with well-controlled bump geometry and composition, and uniformity within 10% over the entire wafer. In this paper, we will describe our process and present our results on the bump properties, such as composition, melting point, and microstructure of the bumps.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"92 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012552","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

Abstract

Eutectic tin-silver (Sn-Ag), tin-copper (Sn-Cu), and tin-silver-copper (Sn-Ag-Cu) solder alloys are potential lead-free materials for low-temperature processing of solder bumps on wafers. But, before they can be adopted to replace the existing lead-free materials, processes have to be developed to provide controls over composition, height and shape uniformity, and defect formation, such as micro-voids, which are detrimental to bump reliability. Over the last six years, we have developed an electroplating technology using a dip-plating machine for processing the three types of eutectic lead-free solder bumps on silicon wafer. Our process is suitable for mass production with well-controlled bump geometry and composition, and uniformity within 10% over the entire wafer. In this paper, we will describe our process and present our results on the bump properties, such as composition, melting point, and microstructure of the bumps.

查看原文本刊更多论文

电镀无铅焊点的工艺、性能和可靠性

共晶锡银(Sn-Ag)、锡铜(Sn-Cu)和锡银铜(Sn-Ag- cu)钎料合金是极具潜力的无铅材料，可用于硅片上的低温钎料凸起加工。但是，在它们被用来取代现有的无铅材料之前，必须开发工艺来控制成分、高度和形状均匀性，以及缺陷的形成，如微空洞，这些都不利于碰撞的可靠性。在过去的六年里，我们开发了一种电镀技术，使用浸镀机处理硅片上的三种共晶无铅焊点。我们的工艺适合大批量生产，凹凸几何形状和成分控制良好，整个晶圆均匀度在10%以内。在本文中，我们将描述我们的过程，并介绍我们的结果在凹凸的性质，如组成，熔点，和凹凸的微观结构。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

自引率

0.00%

发文量