A Broadband 220-320 GHz Medium Power Amplifier Module

A. Tessmann, A. Leuther, V. Hurm, H. Massler, S. Wagner, M. Kuri, M. Zink, M. Riessle, H. Stulz, M. Schlechtweg, O. Ambacher
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引用次数: 22

Abstract

In this paper, we present the development of an ultra-broadband H-band (220 - 325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) medium power amplifier (MPA) module for use in next generation high-resolution imaging systems and communication links operating around 300 GHz. Therefore, a variety of compact amplifier circuits has been developed by using an advanced 35 nm InAlAs/InGaAs based depletion-type metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide (GCPW) circuit topology. A three-stage amplifier S-MMIC based on compact cascode devices was realized, demonstrating a maximum gain of 22.2 dB at 294 GHz and a small-signal gain of more than 16 dB over the frequency range from 184 to 312 GHz. Finally, mounting and packaging of the monolithic amplifier chip into a WR-3.4 waveguide module was accomplished with only minor reduction in circuit performance.
一种宽带220-320 GHz中功率放大器模块
在本文中,我们提出了一种超宽带h波段(220 - 325 GHz)亚毫米波单片集成电路(S-MMIC)中功率放大器(MPA)模块的开发,用于下一代高分辨率成像系统和300 GHz左右的通信链路。因此,采用先进的35 nm基于InAlAs/InGaAs的耗尽型高电子迁移率晶体管(mHEMT)技术结合接地共面波导(GCPW)电路拓扑结构,开发了各种紧凑的放大器电路。实现了一种基于紧凑级联码器件的三级放大器S-MMIC,在294 GHz时最大增益为22.2 dB,在184 ~ 312 GHz频率范围内小信号增益超过16 dB。最后,将单片放大器芯片安装并封装到WR-3.4波导模块中,电路性能仅略有降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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