Molecular layer epitaxy for future devices

T. Kurabayashi, J. Nishizawa
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Abstract

Molecular layer epitaxies (MLE) of GaAs related compounds and Si with SiO/sub 2/ deposition has been developed to realize THz operating devices. At a lower process temperature than for conventional growth methods, device quality epitaxial layers were achieved by molecular layer epitaxy, In GaAs MLE, 100 /spl Aring/ scale static induction transistors are fabricated by MLE operating in a mixed ballistic-tunneling mode or in the pure tunneling mode. For device applications basic research in the fields of surface science and material science are studied.
未来器件的分子层外延
采用SiO/sub - 2/沉积方法将GaAs相关化合物和Si进行分子层外延(MLE),实现太赫兹操作器件。在比传统生长方法更低的工艺温度下,通过分子层外延可以获得器件质量的外延层。在GaAs MLE中,通过MLE在混合弹道隧道模式或纯隧道模式下工作,可以制备出100 /spl /尺度的静态感应晶体管。在器件应用方面,研究了表面科学和材料科学领域的基础研究。
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