Modeling of cylindrical pin-fin heat sinks for electronic packaging

Abstract

Analytical models are presented for determining heat transfer from in-line and staggered pin-fin heat sinks used in electronic packaging applications. The heat transfer coefficient for the heat sink and the average temperature for the fluid inside the heat sink are obtained from an energy balance over a control volume. In addition, friction coefficient models for both arrangements are developed from published data. The effects of thermal conductivity on the thermal performance are also examined. All models can be applied over a wide range of heat sink parameters and are suitable for use in the design of pin-fin heat sinks. The presented models are in good agreement with existing experimental/numerical data.