Performance analyse on millimetre-wave bonding-wire interconnection

Abstract

This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement results of the bonding-wire up to 170 GHz are obtained.