{"title":"Brightfield iADC Applications for Yield Learning and Excursion Monitoring","authors":"J. Wittenzellner","doi":"10.1109/ASMC.2006.1638752","DOIUrl":null,"url":null,"abstract":"Inline ADC provides classification data for all detected wafer defects at run time, without having a negative impact on tool throughput. MTV has successfully used iADC to monitor excursions as well as predict probe fails using inline inspections. The use of iADC has reduced MTV's reliance on SEM review and allowed for more consistent disposition of process issues on the production floor. While iADC is not a standalone solution to yield improvement, it does provide another powerful tool for the defect engineer","PeriodicalId":407645,"journal":{"name":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2006.1638752","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Inline ADC provides classification data for all detected wafer defects at run time, without having a negative impact on tool throughput. MTV has successfully used iADC to monitor excursions as well as predict probe fails using inline inspections. The use of iADC has reduced MTV's reliance on SEM review and allowed for more consistent disposition of process issues on the production floor. While iADC is not a standalone solution to yield improvement, it does provide another powerful tool for the defect engineer