{"title":"Analysis and modeling of liquid cooled heat sinks with alternating honeycomb structure","authors":"H.Y. Zhang, Y. Mui, M. Tarin","doi":"10.1109/EPTC.2009.5416561","DOIUrl":null,"url":null,"abstract":"In this paper, the analysis and modeling of a new type of liquid cooled heat sink are conducted. The heat sink is represented by alternating metallic foil layers with nearly honeycomb-shaped porous structure. The major advantage of this type of heat sink lies in the ease of fabrication with controllable geometrical parameters. The solid volume fractions and effective thermal conductivity in heat flow direction are analyzed with strut geometry and cylinder size. In order to examine the thermal performance with electronic packages, the simulation model is constructed with an off-the-shelf honeycomb heat sink (HCHS) with footprint size of 42mm × 42mm. The flow fields, pressure and temperature profiles are obtained based on the present model. Parametric effects including the flowrates, the solid struts, and base plate bonding materials on thermal performance are examined. Experimental study was also conducted to verify simulation modeling.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 11th Electronics Packaging Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2009.5416561","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, the analysis and modeling of a new type of liquid cooled heat sink are conducted. The heat sink is represented by alternating metallic foil layers with nearly honeycomb-shaped porous structure. The major advantage of this type of heat sink lies in the ease of fabrication with controllable geometrical parameters. The solid volume fractions and effective thermal conductivity in heat flow direction are analyzed with strut geometry and cylinder size. In order to examine the thermal performance with electronic packages, the simulation model is constructed with an off-the-shelf honeycomb heat sink (HCHS) with footprint size of 42mm × 42mm. The flow fields, pressure and temperature profiles are obtained based on the present model. Parametric effects including the flowrates, the solid struts, and base plate bonding materials on thermal performance are examined. Experimental study was also conducted to verify simulation modeling.